PCB enters into the cooling area to solidify the solder joint reflow welding is completed.The liquid solder can wet, diffuse, diffuse or reflow the solder pad, component end and pin of PCB to form a solder joint. When the PCB enters the welding area, the temperature rises hastily to make the solder paste melt.When PCB enters the insulation area, the PCB and components are fully preheated to prevent PCB and components from being damaged due to PCB suddenly entering the welding high-temperature area.The solder paste softens, collapses, and covers the pad, isolating the pad and component pin from oxygen. At the same time, the flux in the solder paste moistens the pad, component end, and pin.
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